Course code 02 42 6179 01
ECTS credits 4
Course name in language of instruction 
Microassembly Technology
Course name in Polish Microassembly Technology
Course name in English 
Microassembly Technology
Language of instruction English
Type of classes
Teaching hours per semester
Lecture Tutorials Laboratory Project Seminar Other E-learn.
Contact hours 10 30 20
Distance learning No No No No No No No
Weighted grades 0.50 0.50 0
Unit running the course Katedra Przyrządów Półprzewodnikowych i Optoelektronicznych
Course coordinator dr inż. Łukasz Ruta
Course instructors dr inż. Łukasz Ruta
Prerequisites 
Knowledge in the field of basics of electrical engineering, electronics and construction of semiconductor structures.
Course learning outcomes
  1. Student knows the methods and process of the design and manufacture of electronic circuits on printed circuit boards.
  2. Student is able to analyze problems occurring during the design and manufacture of electronic circuits.
  3. Student knows the course and application of the screen printing process.
  4. Student knows the course and application of wire-bonding process in microelectronics.
Assessment methods Knowledge test. Project report.
Programme learning outcomes
  1. In-depth knowledge and comprehension of complex concepts and phenomena in the field of electronics and telecommunications, methods and theories explaining the dependences between them, as well as main development trends in electronics and telecommunications; knowledge of the fundamentals of life cycle of electronic and telecommunication devices and systems.
  2. Ability to apply the engineering knowledge to design according to specific needs, and to critically analyse and to judge operation of electronic and telecommunication devices and systems, with consideration of non-technical factors; ability to formulate and to test hypotheses related to simple research problems in electronics and telecommunications.
Grading policies Passing the test at a level not lower than 60%. Passing the project report.
Course content LECTURE: Lecture covers basic issues of designing and realizing printed circuits and modern technologies of electronic device manufacturing. CAD tools for printed circuit board design, assembly and verification. Practical knowledge concerning PCB substrates, electronic elements and packages. Using of practical knowledge concerning types of conecting between elements and element with subtrates: soldering and bonding. Practical knowledge about the types and methods of producing thick-film systems. PROJECT: Students become acquainted with manufacturing processes of chosen electronic circuits with PCB technology. Students will individually manufacture the circuits. Students will manufacture the thick-film electronic elements and circuits using screen printing method. Students will individually make the connections between semiconductor structures and packages using wire bonding method. All of manufactured devices and circuits will be optically and electrically examined. OTHER: implementation of the project in groups in laboratories, additional consultations with the supervisor.
Basic reference materials 
  1. R. Kisiel, A. Bajera, Podstawy konstruowania urządzeń elektronicznych, Politechnika Warszawska 1999
  2. L. Spiralski A. Konczakowska, Podstawy technologii i konstrukcji urządzeń i systemów elektronicznych, cz I i cz II skrypt Wyższej Szkoły Morskiej 1996
  3. S. Wiśniewski, T.S. Wiśniewski, Wymiana ciepła, Wyd. 5, WNT, Warszawa, 2000
  4. T. Pelc, J. Boczyński, Odprowadzanie ciepłą z przyrządów półprzewodnikowych, WKŁ, Warszawa, 1986
  5. Y. Jin, Z. Wang, J. Chen, Introduction to Microsystem Packaging Technology, CRC Press, 2011
Other reference materials 
none
Course workload
Type of classes Teaching hours
Lecture 10
Project 30
Other 20
Self study 40
SUM : 100
Comments 

                    

                    

                        Updated on 
                        2024-09-09 10:38:12