Course code 02 48 6090 01
ECTS credits 4
Course name in language of instruction 
Micro and Nanotechnology for Electronics
Course name in Polish Micro and Nanotechnology for Electronics
Course name in English 
Micro and Nanotechnology for Electronics
Language of instruction English
Type of classes
Teaching hours per semester
Lecture Tutorials Laboratory Project Seminar Other E-learn.
Contact hours 10 30 20
Distance learning No No No No No No No
Weighted grades 0.50 0.50 0
Unit running the course Katedra Przyrządów Półprzewodnikowych i Optoelektronicznych
Course coordinator dr inż. Andrzej Kubiak
Course instructors dr inż. Andrzej Kubiak, dr inż. Łukasz Ruta
Prerequisites 
Knowledge in the field of construction and operation of semiconductor devices, knowledge of metrology.
Course learning outcomes
  1. Student knows and knows how to use basic technological processes and research methods used in micro and nanoelectronics
  2. Student knows the physical basis of construction and operation of selected types of scientific or technical equipment and can use it
Assessment methods Verification of knowledge presented during the lecture in written or oral form. Reports from project realization.
Programme learning outcomes
  1. In-depth knowledge and comprehension of complex concepts and phenomena in the field of electronics and telecommunications, methods and theories explaining the dependences between them, as well as main development trends in electronics and telecommunications; knowledge of the fundamentals of life cycle of electronic and telecommunication devices and systems.
  2. Ability to apply the engineering knowledge to design according to specific needs, and to critically analyse and to judge operation of electronic and telecommunication devices and systems, with consideration of non-technical factors; ability to formulate and to test hypotheses related to simple research problems in electronics and telecommunications.
Grading policies Knowledge of the issues presented during the lecture at a level of not less than 50%. Passing all project reports.
Course content Lecture: Definition of micro and nanotechnology. Semiconductor materials, their properties, manufacture and machining. Chemical processing of wafers in semiconductor technology. Technology of photolithography processes. Exposure and development. Photolithographic masks. Lithography in X-rays, electron and ionolitography. Etching of semiconductor substrates. Types and techniques of etching. Effect of etching on the quality of the obtained structures. Modification of semiconductor properties - doping. Diffusion and diffusion technology. Implantation and its technology. Vacuum deposition of thin metallic and non-metallic layers. Chemical deposition from the volatile phase. Homo and heteroepitaxy. Plasma assisted deposition technologies. Assembly and encapsulation of structures. Internal wire and non-wire connections. Summary of semiconductor systems manufacturing technology. Examples of functioning technological processes. Properties of mechanical structures on the nano scale. Devices and methods for characterizing the properties of structures during their manufacture. Mechatronic structures - production, application, directions of development. Nanotechnologies - new materials and application possibilities. The use of modern research techniques in nano- and micro technologies. Project: An exercise cycle that allows students to familiarize themselves with the basic processes of silicon micro- and nanotechnology and to independently plan and make a simple semiconductor device. Performing the process of thermal oxidation of silicon substrates and characterization of the obtained SiO2 layers by means of an ellipsometer. Conducting thermal diffusion process of dopants and determination of physical properties of obtained structures. The use of vacuum technique for evaporation of various metals, characterization of the properties of the obtained layers. Performing a pattern trensfer process using photolithography. Obtaining and microscopic observation of exemplary microelectronic structures. Carrying out the anisotropic etching of silicon to the desired depth. The choice of process parameters and the manufacturing of a functional semiconductor device, e.g. photovoltaic cell, bipolar transistor or unipolar transistor. Characterization of electrical parameters of the fabricated devices. Other: implementation of tasks in groups or subgroups in laboratories, additional consultations with the supervisor.
Basic reference materials 
  1. Semiconductor Devices: Physics and Technology, 3rd Edition, Ming-Kwei Lee, Simon M. Sze; John Wiley & Sons, 2012
  2. Technologia krzemowa, R. Beck, PWN Warszawa 1991
  3. Nanotechnologie, R. W. Kelsall, I. W. Hamley, M. Geoghegan, PWN Warszawa 2012
Other reference materials 
  1. Procesy technologiczne w elektronice półprzewodnikowej, Praca zbiorowa, WNT Warszawa 1980
Course workload
Type of classes Teaching hours
Lecture 10
Project 30
Other 20
Self Work 65
SUM : 125
Comments 
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Updated on 2024-09-16 12:15:41